Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films

US11508611B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Kalyanjit Ghosh · Pleasanton, US
• Mayur Govind Kulkarni · Sunnyvale, US
• Sanjeev Baluja · Campbell, US
• Praket P. Jha · San Jose, US
• Krishna Nittala · Sunnyvale, US

Key dates

• Filing date: Oct 25, 2019
• Grant date: Nov 22, 2022
• Expiry date: Nov 21, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68757
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Implementations disclosed herein generally provide a lift pin that can improve the deposition rate and uniform film thickness above lift pin areas. In one implementation, the lift pin includes a first end coupling to a shaft, the first end having a pin head, and the pin head having a top surface, wherein the top surface is planar and flat, and a second end coupling to the shaft, the second end having a flared portion, wherein the flared portion has an outer surface extended along a direction that is at an angle of about 110° to about 140° with respect to a longitudinal axis of the lift pin.