Method of determining control parameters of a device manufacturing process
US11513442B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2018 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Sep 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.