Graded dimple height pattern on heater for lower backside damage and low chucking voltage
US11515191B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2019 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Dec 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein may include a heater pedestal. In an embodiment, the heater pedestal may comprise a heater pedestal body and a conductive mesh embedded in the heater pedestal. In an embodiment, the conductive mesh is electrically coupled to a voltage source In an embodiment, the heater pedestal may further comprise a support surface on the heater pedestal body. In an embodiment, the support surface comprises a plurality of pillars extending out from the heater pedestal body and arranged in concentric rings. In an embodiment pillars in an outermost concentric ring have a height that is greater than a height of pillars in an innermost concentric ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.