Support plate for localized heating in thermal processing systems

US11521868B2 · kind B2 · utility

Assignees

• Beijing E-Town Semiconductor Technology Co., Ltd. · CN
• Mattson Technology, Inc. · US

Inventors

• Rolf Bremensdorfer · Bibertal, DE
• Johannes Keppler · Blaustein, DE
• Michael X. Yang · Palo Alto, US
• Thorsten Hülsmann · Tomerdingen, DE

Key dates

• Filing date: Mar 18, 2019
• Grant date: Dec 6, 2022
• Expiry date: Jul 17, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68785
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.