Coaxial see-through alignment imaging system
US11526088B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2021 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Aug 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Aspects of the present disclosure provide an imaging system. For example, in the imaging system a first light source can generate a first light beam of a first wavelength, a second light source can generate a second light beam of a second wavelength, the second light beam having power sufficient to pass through at least a portion of a thickness of a wafer, an alignment module can coaxially align the second light beam with the first light beam, a coaxial module can focus the coaxially aligned first and second light beams onto a first pattern located on a front side of the wafer and a second pattern located below the first pattern, respectively, and an image capturing module can capture a first image of the first pattern and a second image of the second pattern. The second image can be captured via quantum tunneling imaging or infrared (IR) transmission imaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.