David Conklin
9Patents
1h-index
10Co-inventors
48Inventor score
Filing activity: Oct 29, 2003 → Mar 1, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7077311B1 | Document transport control system | Performing Operations; Transporting | 2 | Expired |
| US11526088B2 | Coaxial see-through alignment imaging system | Electricity | 0 | Active |
| US12381118B2 | 3D multiple location compressing bonded arm for advanced integration | Electricity | 0 | Active |
| US12204253B2 | In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones | Physics | 0 | Active |
| US12393125B2 | Coaxial see-through inspection system | General | 0 | Revoked |
| US12381093B2 | Hybrid patterning-bonding semiconductor tool | Electricity | 0 | Active |
| US12411412B2 | Patterning semiconductor features | Physics | 0 | Active |
| US11994807B2 | In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones | Physics | 0 | Active |
| US12374562B2 | Wafer shape control for W2W bonding | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.