Passive component embedded in an embedded trace substrate (ETS)
US11552023B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2020 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Jul 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Certain aspects of the present disclosure generally relate to an embedded trace substrate (ETS) with one or more passive components embedded therein. Such an ETS may provide shorter routing, smaller loop area, and lower parasitics between a semiconductor die and a land-side passive component embedded in the ETS. One example embedded trace substrate generally includes a core, a first insulating material disposed above the core and having a first metal pattern embedded therein, a second insulating material disposed below the core and having a second metal pattern embedded therein, and one or more passive components embedded in the core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.