Semiconductor device including current spread region
US11552170B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2020 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Oct 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a silicon carbide semiconductor body. A first shielding region of a first conductivity type is connected to a first contact at a first surface of the silicon carbide semiconductor body. A current spread region of a second conductivity type is connected to a second contact at a second surface of the silicon carbide semiconductor body. A doping concentration profile of the current spread region includes peaks along a vertical direction perpendicular to the first surface. A doping concentration of one peak or one peak-group of the peaks is at least 50% higher than a doping concentration of any other peak of the current spread region. A vertical distance between the one peak or the one peak-group of the current spread region and the first surface is larger than a second vertical distance between the first surface and a maximum doping peak of the first shielding region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.