Compliant organic substrate assembly for rigid probes
US11561243B2 · kind B2 · utility
0Cited by
39References
16Claims
0Family size
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Key dates
| Filing date | Sep 12, 2019 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Jan 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A wafer test device and methods of assembling a wafer test device involve a first laminate structure, and a second laminate structure arranged to interface with a microcircuit of the wafer. The wafer test device includes a compliant layer between the first laminate structure and the second laminate structure. The compliant layer includes an elastomer that exhibits compliance within a limited range of movement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.