Method of deep learning-based examination of a semiconductor specimen and system thereof

US11568531B2 · kind B2 · utility

Assignee

• Applied Materials Israel Ltd. · IL

Inventors

• Ohad Shaubi · Yavne, IL
• Denis Suhanov · Ashdod, IL
• Assaf Asbag · Gdera, IL
• Boaz Cohen · al-Araqeeb, IL

Key dates

• Filing date: Jun 3, 2020
• Grant date: Jan 31, 2023
• Expiry date: Apr 2, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G06T2207/30148
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

There is provided a method of examination of a semiconductor specimen and a system thereof. The method comprises: using a trained Deep Neural Network (DNN) to process a fabrication process (FP) sample, wherein the FP sample comprises first FP image(s) received from first examination modality(s) and second FP image(s) received from second examination modality(s) which differs from the first examination modality(s), and wherein the trained DNN processes the first FP image(s) separately from the second FP image(s); and further processing by the trained DNN the results of such separate processing to obtain examination-related data specific for the given application and characterizing at least one of the processed FP images. When the FP sample further comprises numeric data associated with the FP image(s), the method further comprises processing by the trained DNN at least part of the numeric data separately from processing the first and the second FP images.