Semiconductor devices with flexible reinforcement structure
US11574820B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Jul 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68368
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for manufacturing semiconductor devices having a flexible reinforcement structure, and associated systems and devices, are disclosed herein. In one embodiment, a method of manufacturing a semiconductor device includes electrically coupling at least one semiconductor die to a redistribution structure on a first carrier. The semiconductor die can include a first surface connected to the redistribution structure and a second surface spaced apart from the redistribution structure. The method also includes reducing a thickness of the semiconductor die to no more than 10 μm. The method further includes coupling a flexible reinforcement structure to the second surface of the at least one semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.