Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
US11577358B2 · kind B2 · utility
1Cited by
48References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2020 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | May 10, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.