Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates
US11610706B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Jan 12, 2018 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Oct 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F17/062
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate for an integrated circuit package, the substrate comprising a dielectric, at least one conductor plane within the dielectric, and a planar magnetic structure comprising an organic magnetic laminate embedded within the dielectric, wherein the planar magnetic structure is integrated within the at least one conductor plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.