Electrostatic chuck with embossments that comprise diamond-like carbon and deposited silicon-based material, and related methods
US11612972B2 · kind B2 · utility
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6References
20Claims
0Family size
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Key dates
| Filing date | Aug 27, 2021 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Aug 27, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including embossments that are made of multiple deposited layers, the layers including diamond-like carbon layers and layers that contain silicon-based materials such as silicon carbide layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.