Patent · US Active

Power electronic assembly and method of producing thereof

US11632860B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Petteri Palm · Regensburg, DE
Martin Benisek · Regensburg, DE
Liu Chen · Munich, DE
Frank Daeche · Unterhaching, DE
Josef Maerz · Oberhaching, DE

Key dates

Filing date	Oct 25, 2019
Grant date	Apr 18, 2023
Priority date	—
Expiry date	Apr 2, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10166
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a power device embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the power device and configured to distribute a load current switched by the power device. A fourth metal layer is positioned between the second metal layer and the power device and configured as a primary thermal conduction path for heat generated by the power device during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.