Methods and systems to enhance process uniformity
US11637002B2 · kind B2 · utility
1Cited by
941References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2014 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Nov 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductor processing chamber may include a remote plasma region, and a processing region fluidly coupled with the remote plasma region. The processing region may be configured to house a substrate on a support pedestal. The support pedestal may include a first material at an interior region of the pedestal. The support pedestal may also include an annular member coupled with a distal portion of the pedestal or at an exterior region of the pedestal. The annular member may include a second material different from the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.