Low-debris fluopolymer composite CMP polishing pad

US11638978B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

• Nan-Rong Chiou · Wilmington, US
• Joseph So · Newark, US
• Mohammad T. Islam · Middletown, US
• Matthew R. Gadinski · Nonatum Mills, US
• Youngrae Park · Wilmington, US
• George C. Jacob · Newark, US

Key dates

• Filing date: Jun 10, 2019
• Grant date: May 2, 2023
• Expiry date: Jan 3, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention provides a polymer-polymer composite polishing pad useful for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The polymer-polymer composite polishing pad includes a polishing layer having a polishing surface for polishing or planarizing the substrate; a polymeric matrix forming the polishing layer and including gas-filled or liquid-filled polymeric microelements; and fluoropolymer particles embedded in the polymeric matrix. The fluoropolymer particles have a tensile strength lower than the tensile strength of the polymeric matrix wherein diamond abrasive materials cut the fluoropolymer to form a reduced number of pad debris particles in the 1 μm to 10 μm size range.