Patent · US Active

Processing of workpieces using fluorocarbon plasma

US11651977B2 · kind B2 · utility

0Cited by
6References
19Claims
0Family size

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Key dates

Filing dateMar 30, 2021
Grant dateMay 16, 2023
Priority date
Expiry dateMay 8, 2041

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/334
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Methods for processing a workpiece are provided. Conducting a thermal treatment on a workpiece are provided. The workpiece contains at least one layer of metal. The method can include generating one or more species from a process gas. The process gas can include hydrogen or deuterium. The method can include filtering the one or more species to create a filtered mixture and exposing the workpiece to the filtered mixture. An oxidation process on a workpiece are provided. The method can be conducted at a process temperature of less than 350° C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.