Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB)
US11658378B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2019 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Feb 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.