Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same
US11664291B2 · kind B2 · utility
1Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2020 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Dec 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor assemblies including thermal management configurations for reducing heat transfer between overlapping devices and associated systems and methods are disclosed herein. A semiconductor assembly may comprise a first device and a second device with a thermally conductive layer, a thermal-insulator interposer, or a combination thereof disposed between the first and second devices. The thermally conductive layer and/or the thermal-insulator interposer may be configured to reduce heat transfer between the first and second devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.