Patent · US Active

Substrate placing table and substrate processing apparatus

US11676847B2 · kind B2 · utility

0Cited by

0References

16Claims

0Family size

Assignee

TOKYO ELECTRON LIMITED · JP

Inventors

Satoshi Taga · Rifu, JP
Naoyuki Satoh · Yokohama, JP
Tatsuo Nishita · Amagasaki, JP

Key dates

Filing date	Oct 17, 2022
Grant date	Jun 13, 2023
Priority date	—
Expiry date	Oct 17, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A substrate placing table according to an exemplary embodiment includes a base and an electrostatic chuck provided on the base. The electrostatic chuck includes a lamination layer portion, an intermediate layer, and a covering layer. The lamination layer portion is provided on the base. The intermediate layer is provided on the lamination layer portion. The covering layer is provided on the intermediate layer. The lamination layer portion includes a first layer, an electrode layer, and a second layer. The first layer is provided on the base. The electrode layer is provided on the first layer. The second layer is provided on the electrode layer. The intermediate layer is provided between the second layer and the covering layer and is in close contact with the second layer and the covering layer. The second layer is a resin layer. The covering layer is ceramics.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.