Patent · US Active

Method for transferring chips

US11694991B2 · kind B2 · utility

0Cited by

2References

16Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Frank Fournel · Meylan, FR
Emilie Bourjot · Cohoes, US
Severine Cheramy · Grenoble, FR
Sylvain Maitrejean · Paris, FR
Loic Sanchez · Voiron, FR

Key dates

Filing date	Jun 24, 2021
Grant date	Jul 4, 2023
Priority date	—
Expiry date	Aug 28, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1515
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for transferring at least one chip, from a first support to a second support, includes forming, while the chip is assembled to the first support, an interlayer in the liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support and a solidification of the interlayer. Then, the chip is detached from the first support while maintaining the interlayer in the solid state.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.