Sylvain Maitrejean
23Patents
2h-index
41Co-inventors
53Inventor score
Filing activity: Dec 19, 2008 → Jun 24, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9502558B2 | Local strain generation in an SOI substrate | Electricity | 4 | Active |
| US10600786B2 | Method for fabricating a device with a tensile-strained NMOS transistor and a uniaxial compression strained PMOS transistor | Electricity | 2 | Active |
| US9853124B2 | Method for fabricating a nanowire semiconductor transistor having an auto-aligned gate and spacers | Electricity | 2 | Active |
| US9761607B2 | Method for producing strained semi-conductor blocks on the insulating layer of a semi-conductor on insulator substrate | Electricity | 2 | Active |
| US9704709B2 | Method for causing tensile strain in a semiconductor film | Electricity | 2 | Active |
| US9230991B2 | Method to co-integrate oppositely strained semiconductor devices on a same substrate | Electricity | 1 | Active |
| US9536951B2 | FinFET transistor comprising portions of SiGe with a crystal orientation [111] | Electricity | 1 | Active |
| US11195711B2 | Healing method before transfer of a semiconducting layer | Electricity | 1 | Active |
| US11424121B2 | Method for forming a layer by cyclic epitaxy | Electricity | 0 | Active |
| US11694991B2 | Method for transferring chips | Electricity | 0 | Active |
| US10978594B2 | Transistor comprising a channel placed under shear strain and fabrication process | Electricity | 0 | Active |
| US11081463B2 | Bonding method with electron-stimulated desorption | Electricity | 0 | Active |
| US8847395B2 | Microelectronic device having metal interconnection levels connected by programmable vias | Electricity | 0 | Active |
| US12198940B2 | Method for modifying the strain state of a block of a semiconducting material | Electricity | 0 | Active |
| US12322717B2 | Semiconductor device and method for manufacturing a semiconductor device | Electricity | 0 | Active |
| US11688811B2 | Transistor comprising a channel placed under shear strain and fabrication process | Electricity | 0 | Active |
| US8367547B2 | Method for creating a metal crystalline region, in particular in an integrated circuit | Electricity | 0 | Active |
| US10879083B2 | Method for modifying the strain state of a block of a semiconducting material | Electricity | 0 | Active |
| US10665497B2 | Method of manufacturing a structure having one or several strained semiconducting zones that may for transistor channel regions | Electricity | 0 | Active |
| US8114777B2 | Horizontal nanotube/nanofiber growth method | Electricity | 0 | Active |
| US11810789B2 | Method of fabricating a semiconductor substrate having a stressed semiconductor region | Electricity | 0 | Active |
| US9460971B2 | Method to co-integrate oppositely strained semiconductor devices on a same substrate | Electricity | 0 | Active |
| US9853130B2 | Method of modifying the strain state of a semiconducting structure with stacked transistor channels | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.