Temperature-based assymetry correction during CMP and nozzle for media dispensing

US11697187B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Haosheng Wu · San Jose, US
• Shou-Sung Chang · Mountain View, US
• Jianshe Tang · San Jose, US
• Chih Chung · San Jose, US
• Hui Chen · Burlingame, US
• Hari Soundararajan · Sunnyvale, US
• Benjamin Cherian · San Jose, US

Key dates

• Filing date: Apr 15, 2020
• Grant date: Jul 11, 2023
• Expiry date: Jan 23, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.