Patent · US Active

Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production

US11699640B2 · kind B2 · utility

0Cited by

1References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Stoek · Buxtehude, DE
Frank Daeche · Unterhaching, DE
Chee Voon Tan · Seremban, MY

Key dates

Filing date	Jun 21, 2021
Grant date	Jul 11, 2023
Priority date	—
Expiry date	Jul 8, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/0047
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power module for PCB embedding includes: a leadframe; a power semiconductor die with a first load terminal and control terminal at a first side of the die and a second load terminal at the opposite side, the second load terminal soldered to the leadframe; a first metal clip soldered to the first load terminal and forming a first terminal of the power module at a first side of the power module; and a second metal clip soldered to the control terminal and forming a second terminal of the power module at the first side of the power module. The leadframe forms a third terminal of the power module at the first side of the power module, or a third metal clip is soldered to the leadframe and forms the third terminal. The power module terminals are coplanar within +/−30 μm at the first side of the power module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.