Methods for a web-based CMP system

US11717936B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Dmitry Sklyar · San Jose, US
• Jeonghoon Oh · San Jose, US
• Gerald Alonzo · Los Gatos, US
• Jonathan P. Domin · Sunnyvale, US
• Steven M. Zuniga · Soquel, US
• Jay Gurusamy · Santa Clara, US

Key dates

• Filing date: Aug 27, 2019
• Grant date: Aug 8, 2023
• Expiry date: May 28, 2042

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/10
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.