Patent · US Active

Mask arrangement for masking a substrate in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a mask arrangement for masking a substrate in a processing chamber

US11718904B2 · kind B2 · utility

0Cited by

2References

23Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Stefan Bangert · Lauentheil, DE
Tommaso Vercesi · Aschaffenburg, DE
Daniele GISLON · Venezia, IT
Oliver Heimel · Wabern, DE
Andreas Lopp · Neuses, DE
Dieter Haas · Bruchköbel, DE

Key dates

Filing date	Jun 26, 2019
Grant date	Aug 8, 2023
Priority date	—
Expiry date	Apr 13, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH10K71/166
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A mask arrangement for masking a substrate in a processing chamber is provided. The mask arrangement includes a mask frame having one or more frame elements and is configured to support a mask device, wherein the mask device is connectable to the mask frame; and at least one actuator connectable to at least one frame element of the one or more frame elements, wherein the at least one actuator is configured to apply a force to the at least one frame element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.