Method and system to monitor a process apparatus
US11733610B2 · kind B2 · utility
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3References
20Claims
0Family size
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Key dates
| Filing date | Dec 20, 2019 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Dec 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method involving determining a contribution that one or more process apparatuses make to a characteristic of a substrate after the substrate has been processed according to a patterning process by the one or more process apparatuses by removing from values of the characteristic of the substrate a contribution of a lithography apparatus to the characteristic and a contribution of one or more pre-lithography process apparatuses to the characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.