Accommodating device for retaining wafers
US11756818B2 · kind B2 · utility
0Cited by
17References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2022 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | May 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.