Method of determining control parameters of a device manufacturing process
US11768442B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2022 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Oct 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method including: obtaining an image of at least part of a substrate, wherein the image includes at least one feature of a device being manufactured in a layer on the substrate; obtaining a layout of features associated with a previous layer adjacent to the layer on the substrate; calculating one or more image-related metrics in dependence on: 1) a contour determined from the image including the at least one feature and 2) the layout; and determining one or more control parameters of a lithographic apparatus and/or one or more further processes in a manufacturing process of the device in dependence on the one or more image-related metrics, wherein at least one of the control parameters is determined to modify the geometry of the contour in order to improve the one or more image-related metrics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.