Patent · US Active

Wafer heater with backside and integrated bevel purge

US11769684B2 · kind B2 · utility

0Cited by

5References

18Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Tejas Ulavi · San Jose, US
Vijay D. Parkhe · San Jose, US
Naveen Kumar Nagaraja · Survanagiri, IN
Sanjeev Baluja · Campbell, US
Surajit Kumar · Sunnyvale, US
Dhritiman Subha Kashyap · Bengaluru, IN
Ashutosh Agarwal · Ghaziabad, IN

Key dates

Filing date	Dec 13, 2022
Grant date	Sep 26, 2023
Priority date	—
Expiry date	Dec 13, 2042

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C16/45544
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.