Plasma source with ceramic electrode plate
US11776793B2 · kind B2 · utility
1Cited by
24References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Aug 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0453
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma source assembly for use with a substrate processing chamber is described. The assembly includes a ceramic lower plate with a plurality of apertures formed therein. A method of processing a substrate in a substrate processing chamber including the plasma source assembly is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.