Phase change memory cell galvanic corrosion prevention
US11800817B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2021 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Mar 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/8828
Abstract
A method for forming a phase-change memory cell includes depositing a metal layer over a wafer such that the metal layer covers connection structures of the wafer. The method further includes removing a portion of the metal layer such that the connection structures of the wafer remain covered by a remaining portion of the metal layer. The method further includes forming a phase-change memory stack on a stack area of the remaining portion of the metal layer. The method further includes removing the remaining portion of the metal layer except in the stack area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.