Silica-based slurry for selective polishing of carbon-based films
US11802220B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Sep 14, 2021 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Sep 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive, (b) a surfactant, (c) an iron cation, (d) optionally a ligand, and (e) water, wherein the silica abrasive has a negative zeta potential in the chemical-mechanical polishing composition. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising a carbon-based film, using said composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.