Method for depositing high quality PVD films
US11802349B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2020 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Sep 10, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B33/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments described herein include a method for depositing a material layer on a substrate while controlling a bow of the substrate and a surface roughness of the material layer. A bias applied to the substrate while the material layer is deposited is adjusted to control the bow of the substrate. A bombardment process is performed on the material layer to improve the surface roughness of the material layer. The bias and bombardment process improve a uniformity of the material layer and reduce an occurrence of the material layer cracking due to the bow of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.