Patent · US Active

Method for depositing high quality PVD films

US11802349B2 · kind B2 · utility

0Cited by
5References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 10, 2020
Grant dateOct 31, 2023
Priority date
Expiry dateSep 10, 2040

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC30B33/04
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Embodiments described herein include a method for depositing a material layer on a substrate while controlling a bow of the substrate and a surface roughness of the material layer. A bias applied to the substrate while the material layer is deposited is adjusted to control the bow of the substrate. A bombardment process is performed on the material layer to improve the surface roughness of the material layer. The bias and bombardment process improve a uniformity of the material layer and reduce an occurrence of the material layer cracking due to the bow of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.