Substrate cleaning components and methods in a plating system
US11814744B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2019 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Jan 14, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing frame may include a rim extending circumferentially about an upper surface of the plating bath vessel and defining a rinsing channel between the rim and the upper surface of the plating bath vessel. The electroplating apparatus may also include a rinsing assembly including a splash guard that is translatable from a recessed first position to a second position extending at least partially across an access to the plating bath vessel. The rinsing assembly may also include a fluid nozzle extending from the rinsing frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.