Integrated assemblies comprising hydrogen diffused within two or more different semiconductor materials, and methods of forming integrated assemblies

US11832454B2 · kind B2 · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Kamal M. Karda · Boise, US
• Yi Fang Lee · Boise, US
• Haitao Liu · Boise, US
• Durai Vishak Nirmal Ramaswamy · Boise, US
• Ramanathan Gandhi · Boise, US
• Karthik Sarpatwari · Boise, US
• Scott E. Sills · Boise, US
• Sameer Chhajed · Boise, US

Key dates

• Filing date: Aug 6, 2021
• Grant date: Nov 28, 2023
• Expiry date: Sep 8, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D99/00

Abstract

Some embodiments include an integrated assembly having a first semiconductor material between two regions of a second semiconductor material. The second semiconductor material is a different composition than the first semiconductor material. Hydrogen is diffused within the first and second semiconductor materials. The conductivity of the second semiconductor material increases in response to the hydrogen diffused therein to thereby create a structure having the second semiconductor material as source/drain regions, and having the first semiconductor material as a channel region between the source/drain regions. A transistor gate is adjacent the channel region and is configured to induce an electric field within the channel region. Some embodiments include methods of forming integrated assemblies.