Process kit ring adaptor

US11842917B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Leon Volfovski · Mountain View, US
• Andreas Schmid · Duisburg, DE
• Denis M. Koosau · Sunnyvale, US
• Nicholas Michael Kopec · Santa Clara, US
• Steven E. Babayan · Los Altos, US
• Douglas R. McAllister · Pleasanton, US
• Helder Lee · San Jose, US
• Jeffrey C. Hudgens · San Francisco, US
• Damon K. Cox · Round Rock, US

Key dates

• Filing date: Mar 29, 2021
• Grant date: Dec 12, 2023
• Expiry date: May 13, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/677
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.