Pellicle, exposure master, exposure device and method for manufacturing semiconductor device
US11852968B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Jan 15, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70983
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
To provide a pellicle in which outgas from an adhesive layer is suppressed. The pellicle includes a pellicle film, a support frame for supporting the pellicle film, a protrusion part arranged in the support frame, a first adhesive layer arranged on the protrusion part; and an inorganic material layer arranged at a position closer to the pellicle film than the first adhesive layer. The inorganic material layer may include a first inorganic material layer arranged at a first side surface of the first adhesive layer, the first side surface of the first adhesive layer intersecting the pellicle film, and arranged at a position closer to the pellicle film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.