Method for characterizing a manufacturing process of semiconductor devices
US11860548B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2020 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Apr 24, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70658
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of determining a characteristic of one or more processes for manufacturing features on a substrate, the method including: obtaining image data of a plurality of features on a least part of at least one region on a substrate; using the image data to obtain measured data of one or more dimensions of each of at least some of the plurality of features; determining a statistical parameter that is dependent on the variation of the measured data of one or more dimensions of each of at least some of the plurality of features; determining a probability of defective manufacture of features in dependence on a determined number of defective features in the image data; and determining the characteristic of the one or more processes to have the probability of defective manufacture of features and the statistical parameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.