Methods of embedding magnetic structures in substrates
US11862552B2 · kind B2 · utility
0Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2022 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Jan 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/086
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.