Patent · US Active

Method of forming a chip package and chip package

US11862600B2 · kind B2 · utility

1Cited by

1References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Scharf · Regensburg, DE
Alexander Heinrich · Bad Abbach, DE
Steffen Jordan · Viehhausen, DE

Key dates

Filing date	Oct 1, 2021
Grant date	Jan 2, 2024
Priority date	—
Expiry date	Mar 23, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15738
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of forming a chip package is provided. The method includes providing a malleable carrier with a layer of an electrically conductive material formed thereon, and positive fitting the malleable carrier to a chip to at least partially enclose the chip with the malleable carrier. The layer at least partially physically contacts the chip, such that the layer electrically contacts a chip contact of the chip. The layer forms a redistribution layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.