Patent · US Active

In-situ apparatus for semiconductor process module

US11887879B2 · kind B2 · utility

0Cited by

57References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Yogananda Sarode Vishwanath · Bengaluru, IN
Steven E. Babayan · Los Altos, US
Stephen Prouty · San Jose, US
Andreas Schmid · Duisburg, DE

Key dates

Filing date	Jul 1, 2021
Grant date	Jan 30, 2024
Priority date	—
Expiry date	Jul 1, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68742
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.