Patent · US Active

Signal delivery in stacked device

US11887969B2 · kind B2 · utility

0Cited by

35References

7Claims

0Family size

Inventors

Brent Keeth · Boise, US
Mark Hiatt · Charlotte, US
Terry R. Lee · Boise, US
Mark E. Tuttle · Boise, US
Rahul Advani · Boise, US
John F. Schreck · Houston, US

Key dates

Filing date	Feb 28, 2022
Grant date	Jan 30, 2024
Priority date	—
Expiry date	Feb 28, 2042

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/5317
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.