Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity

US11897079B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Haosheng Wu · San Jose, US
• Hari Soundararajan · Sunnyvale, US
• Jianshe Tang · San Jose, US
• Shou-Sung Chang · Mountain View, US
• Brian J. Brown · Eastleigh, GB
• Yen-Chu Yang · Santa Clara, US
• You Wang · Cupertino, US
• Rajeev Bajaj · Fremont, US

Key dates

• Filing date: Mar 26, 2020
• Grant date: Feb 13, 2024
• Expiry date: Dec 29, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/30625
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.