You Wang
26Patents
11h-index
75Co-inventors
78Inventor score
Filing activity: Sep 8, 1998 → Sep 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6310755A | Electrostatic chuck having gas cavity and method | Chemistry; Metallurgy | 241 | Expired |
| US6055150A | Multi-electrode electrostatic chuck having fuses in hollow cavities | Emerging Cross-Sectional Technologies | 72 | Expired |
| US6538872B1 | Electrostatic chuck having heater and method | Electricity | 66 | Expired |
| US6490146B2 | Electrostatic chuck bonded to base with a bond layer and method | Chemistry; Metallurgy | 58 | Expired |
| US6094334A | Polymer chuck with heater and method of manufacture | Electricity | 49 | Expired |
| US6462928B1 | Electrostatic chuck having improved electrical connector and method | Electricity | 38 | Expired |
| US6490145B1 | Substrate support pedestal | Electricity | 30 | Expired |
| US6503368B1 | Substrate support having bonded sections and method | Electricity | 30 | Expired |
| US7214297B2 | Substrate support element for an electrochemical plating cell | Chemistry; Metallurgy | 28 | Expired |
| US6583980B1 | Substrate support tolerant to thermal expansion stresses | Electricity | 26 | Expired |
| US6639783B1 | Multi-layer ceramic electrostatic chuck with integrated channel | Emerging Cross-Sectional Technologies | 24 | Expired |
| US7670688B2 | Erosion-resistant components for plasma process chambers | Emerging Cross-Sectional Technologies | 8 | Active |
| US7582564B2 | Process and composition for conductive material removal by electrochemical mechanical polishing | Electricity | 4 | Active |
| US9073169B2 | Feedback control of polishing using optical detection of clearance | Physics | 1 | Active |
| US11060930B2 | Glass surface stress meter and multiple-tempered glass surface stress meter | Chemistry; Metallurgy | 1 | Active |
| US7422982B2 | Method and apparatus for electroprocessing a substrate with edge profile control | Chemistry; Metallurgy | 1 | Active |
| US11911870B2 | Polishing pads for high temperature processing | Performing Operations; Transporting | 0 | Active |
| US11897079B2 | Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity | Electricity | 0 | Active |
| US10786885B2 | Thin plastic polishing article for CMP applications | Electricity | 0 | Active |
| US7576007B2 | Method for electrochemically mechanically polishing a conductive material on a substrate | Electricity | 0 | Active |
| US8210900B2 | Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery | Performing Operations; Transporting | 0 | Active |
| US11211252B2 | Systems and methods for copper (I) suppression in electrochemical deposition | Electricity | 0 | Active |
| US7879255B2 | Method and composition for electrochemically polishing a conductive material on a substrate | Performing Operations; Transporting | 0 | Active |
| US8586481B2 | Chemical planarization of copper wafer polishing | Electricity | 0 | Active |
| US7504018B2 | Electrochemical method for Ecmp polishing pad conditioning | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.