Power electronic assembly having a laminate inlay and method of producing the power electronic assembly

US11903132B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Petteri Palm · Regensburg, DE
• Martin Benisek · Regensburg, DE
• Liu Chen · Munich, DE
• Frank Daeche · Unterhaching, DE
• Josef Maerz · Oberhaching, DE

Key dates

• Filing date: Mar 17, 2023
• Grant date: Feb 13, 2024
• Expiry date: Mar 17, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10166
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a laminate inlay embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the laminate inlay and configured to distribute a load current switched by the laminate inlay. A fourth metal layer is positioned between the second metal layer and the laminate inlay and configured as a primary thermal conduction path for heat generated by the laminate inlay during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.