Method and apparatus for cleaning substrates
US11911807B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Feb 7, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2240/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for cleaning substrates comprising the steps of: placing a substrate on a substrate holder; implementing a bubble less or bubble-free pre-wetting process for the substrate; and implementing an ultra/mega sonic cleaning process for cleaning the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.