Apparatus and method for CMP temperature control
US11919123B2 · kind B2 · utility
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56References
19Claims
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Key dates
| Filing date | Jun 29, 2021 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Sep 8, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/047
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.