Control of processing parameters for substrate polishing with angularly distributed zones using cost function

US11931853B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Eric Lau · Santa Clara, US
• Charles C. Garretson · Sunnyvale, US
• Huanbo Zhang · San Jose, US
• Zhize Zhu · Cupertino, US
• Benjamin Cherian · San Jose, US
• Brian J. Brown · Eastleigh, GB
• Thomas H. Osterheld · Mountain View, US

Key dates

• Filing date: Feb 25, 2022
• Grant date: Mar 19, 2024
• Expiry date: Feb 25, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67092
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Generating a recipe for controlling a polishing system includes receiving a target removal profile that includes a target thickness to remove for a plurality of locations on a substrate that are angularly distributed around the substrate, and storing a first function defining a polishing rate for a zone from a plurality of pressurizable zones of a carrier head that are angularly distributed around a the carrier head. The first function defines polishing rates as a function of pressures. For each particular zone of the plurality of zones a recipe defining a pressure for the particular zone over time is calculated by calculating an expected thickness profile after polishing using the first function, and minimizing a cost function that incorporates a first term representing a difference between the expected thickness profile and a target thickness profile.